Wafer support assembly applied to polishing carrier head for CMP System,申请号KR20030056715-传众专利搜索

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发明名称	Wafer support assembly applied to polishing carrier head for CMP System
摘要
申请公布号	KR100511476(B1)	申请公布日期	2005.08.31
申请号	KR20030056715	申请日期	2003.08.16
申请人		发明人
分类号	H01L21/304;(IPC1-7):H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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