发明名称 |
Method and apparatus for transferring a substrate carrier |
摘要 |
In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations (115; 511-515), wherein the facility further includes a plurality of carrier supports (110; 503) coupled to a conveyor system (101; 501) adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.
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申请公布号 |
EP1569261(A2) |
申请公布日期 |
2005.08.31 |
申请号 |
EP20050004335 |
申请日期 |
2005.02.28 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BRILL, TODD J.;TEFERRA, MICHAEL;PURI, AMIT;JESSOP, DANIEL R.;WARNER, GLADE L.;DUFFIN, DAVID C. |
分类号 |
H01L21/00;B24B5/00;B65G49/04;G05B19/00;H01L21/677;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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