| 摘要 |
1. Method of cutting double-layer plates with structures of semiconductor instruments, especially pressure sensors, consists in cutting a plate stuck to the stretched foil with a circular saw. It is characterised in that the glass surface of a plate consisting of a layer of silicon deposited on a layer of glass is stuck to foil. Then, it is heated and the side of the silicon layer is incised to the depth of 45 percent-47 percent of the plate thickness in directions x and y. Then, the foil is removed from the glass, stuck to the side of the silicon layer and heated. The silicon side of the plate is incised along the visible incisions and [instrument] structures are separated.
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