发明名称 Method for fabricating a memory device having reverse LDD
摘要 A method for fabricating a semiconductor device. Specifically, a method that includes forming a source and drain region in a periphery transistor, exhibiting a channel width between the source and drain regions suitable for operation at predetermined voltages. After forming the source and drain regions, to eliminate diffusion of lightly doped drain regions resulting from a later formation of the source and drain regions, forming the lightly doped drain regions adjacent to the source and drain regions of the periphery transistor. After forming the lightly doped drain regions in the periphery transistor, the method includes forming a source region and a drain region in a core memory cell, independent of forming the source and drain regions in the periphery transistor.
申请公布号 US6936515(B1) 申请公布日期 2005.08.30
申请号 US20030387774 申请日期 2003.03.12
申请人 FASL LLP 发明人 OGAWA HIROYUKI;SUN YU;HUI ANGELA
分类号 H01L21/336;H01L21/8247;H01L27/105;(IPC1-7):H01L21/336 主分类号 H01L21/336
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