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发明名称
Epoxy Resin Composition Containing Bisphenol A Epoxy Resin and Printed Circuit Board Using the Same
摘要
申请公布号
KR100511431(B1)
申请公布日期
2005.08.30
申请号
KR20030007094
申请日期
2003.02.05
申请人
发明人
分类号
C08L63/02;(IPC1-7):C08L63/02
主分类号
C08L63/02
代理机构
代理人
主权项
地址
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