发明名称 |
Releasable microcapsule and adhesive curing system using the same |
摘要 |
An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accelerator. The epoxy adhesive is cured by exposing it to infrared energy. The infrared energy is absorbed by the infrared absorber which disintegrates the wall and allows the accelerator to come into contact with the other adhesive components and initiate the curing polymerization reaction. |
申请公布号 |
US6936644(B2) |
申请公布日期 |
2005.08.30 |
申请号 |
US20020271511 |
申请日期 |
2002.10.16 |
申请人 |
COOKSON ELECTRONICS, INC. |
发明人 |
GILLEO KENNETH B. |
分类号 |
C09J201/00;C08G59/18;C08G59/68;C08J3/24;C09J11/00;C09J163/00;C09J163/02;H05K3/30;(IPC1-7):C08K3/04;C08K9/10;C08K63/00;C08K63/02 |
主分类号 |
C09J201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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