| 摘要 |
In the method for mounting electronic components on substrates by means of pressure sintering, a paste which is composed of a metal powder and a solvent is applied between the component and the substrate. Once the paste has dried completely, the component is placed on the substrate. A number of such arrangements ( 4 ) together with a substrate and component are then compressed at the sintering temperature in an isostatic press ( 6 ). A large number of complex and/or fragile parts can be connected at the same time, and with very high precision.
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