| 摘要 |
A multi-layer flexible wiring board wherein interlayer connections can be accomplished without fail, a high reliability can be ensured, and wherein an external layer wiring board can be stacked. The present invention realizes such a multi-layer flexible wiring board and a method for making the same. Such a multi- layer flexible wiring board comprises (1) a plurality of one-sided wiring boards having, on one side of a support substrate, a wiring pattern and conductive two-layer posts extending from the wiring pattern and protruding from the opposite side of the support substrate, wherein the support substrate other than the most external layer has, on its opposite side to the conductive two-layer posts, pads for connection to the conductive posts and wherein no surface coating is provided to the wiring pattern, (2) a flexible wiring board having, on at least one side thereof, pads for connection to the conductive two-layer posts, and having such a wiring pattern that a surface coating is provided on a flexible part and that no surface coating is provided on a multi-layer part, and (3) an adhesive layer with a flux function, wherein the conductive posts are connected to the pads via the adhesive layer by use of a metal or alloy and wherein the wiring patterns are electrically connected.
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