发明名称 |
THERMOPLASTIC POLYIMIDE RESIN FILM, MULTILAYER BODY AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD COMPOSED OF SAME |
摘要 |
<p>A multilayer body having a two-layer or three-layer structure in which a thermoplastic polyimide layer is formed on one or both sides of a non- thermoplastic polyimide film and the surface of the thermoplastic polyimide layer is subjected to a surface treatment is disclosed. A multilayer body comprising a polymer film and a polyimide resin composition layer which is formed on one or both sides of the polymer film and contains a polyimide resin having a specific structure and a thermosetting component is also disclosed. A resin film at least one side of which has such a surface profile that the arithmetical mean roughness (Ra1) measured at a cut-off of 0.002 mm is 0.05-1 mum and the ratio of Ra1 to the roughness (Ra2) measured at a cut-off of 0.1mm (Ra1/Ra2) is 0.4-1 and a multilayer body composed of such a resin film are further disclosed. By using these multilayer bodies, a printed wiring board which is excellent in adhesiveness and enables formation of a very small wiring circuit can be obtained.</p> |
申请公布号 |
KR20050085558(A) |
申请公布日期 |
2005.08.29 |
申请号 |
KR20057010627 |
申请日期 |
2005.06.10 |
申请人 |
KANEKA CORPORATION |
发明人 |
TANAKA SHIGERU;ITOH TAKASHI;NISHINAKA MASARU;SHIMO OHSAKO KANJI;MURAKAMI MUTSUAKI |
分类号 |
B32B27/34;C23C18/16;C23C18/22;H05K1/03;(IPC1-7):C08J7/06;C08L79/08;C08J5/18 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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