| 摘要 |
A first electrode layer (4), a piezoelectric layer (5), a second electrode layer (6), and a vibration layer (7) are sequentially formed on one side of a silicon substrate (1) in order of mention. Ink chamber partitions (8) and a nozzle plate (11) are formed on the vibration layer (7). The other side of the silicon substrate (1) is ground to a predetermined depth. The remaining substrate (13) is removed by dry-etching. The first electrode layer (4) is patterned to fabricate ink-jet mechanisms (2, 2,...). The ink-jet mechanisms (2, 2,...) are divided to produce ink-jet heads (3, 3,...) at a time. |
