发明名称 |
SYSTEM FOR REDUCING OXIDATION OF ELECTRONIC DEVICES |
摘要 |
<p>The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. A holding device is provided for securing the semiconductor device to a platform. The holding device includes an opening for providing access to an area where the semiconductor device is to be heated and a cavity is coupled to the opening. A gas inlet in fluid communication with the cavity supplies a relatively inert gas to the cavity, whereby to transmit the inert gas to the opening through the cavity and to reduce oxidation of the semiconductor device.</p> |
申请公布号 |
SG113582(A1) |
申请公布日期 |
2005.08.29 |
申请号 |
SG20050000314 |
申请日期 |
2005.01.22 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
DUAN RONG;KWAN KA SHING, KENNY |
分类号 |
B23K20/00;B23K20/10;B23K20/14;H01L21/60 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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