| 摘要 |
Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprise a) one or more polyamic acids soluble in gamma- butyrolactone (GBL) and aqueous tetramethyl ammonium hydroxide, and with the proviso that the polyamic acid is also resistant to a solvent used in a photosensitive composition with which the polyimide precursor composition is to be used; b) a solvent comprising gamma-butyrolactone; and c) one or more adhesion promoters selected from structures described by Formulae: I-VI wherein R1 is H, C1-C10 linear, cyclic or branched alkyl, phenyl or halophenyl or alkyl substituted phenyl, R2 is C1-Cio linear, cyclic or branched alkyl, phenyl, halophenyl or alkyl substituted phenyl or one of the following moieties VII, VIII, or IX where R3 is C1- C4 linear or branched alkyl or C1-C4 linear or branched alkoxy group, R4, R5 and R6 are independently C1-C4 linear or branched alkyl group, m is an integer from 1 to about 4, and n is an integer from 1 to about 5.
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