发明名称 |
METHOD AND SYSTEM FOR FABRICATING MULTILAYER DEVICES ON A SUBSTRATE |
摘要 |
<p>A method for fabricating multi layer active devices on a bulk substrate is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of devices at or on the weak bond regions. Multi layer integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions is disclosed. An arbitrary number of layers can be bonded and stacked to create a predetermined device on the substrate. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.</p> |
申请公布号 |
KR20050083935(A) |
申请公布日期 |
2005.08.26 |
申请号 |
KR20057009160 |
申请日期 |
2005.05.20 |
申请人 |
REVEO, INC. |
发明人 |
FARIS SADEG M. |
分类号 |
G01R31/01;H01L21/66;(IPC1-7):H01L21/30 |
主分类号 |
G01R31/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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