| 发明名称 |
CHIP-SCALE SCHOTTKY DEVICE |
| 摘要 |
A chip-scale schottky package which has at least one cathode electrode and at least one anode electrode disposed on only one major surface of a die, and solder bumps connected to the electrode for surface mounting of the package on a circuit board. |
| 申请公布号 |
KR20050083881(A) |
申请公布日期 |
2005.08.26 |
| 申请号 |
KR20057007637 |
申请日期 |
2005.04.29 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
SKOCKI SLAWOMIR |
| 分类号 |
H01L23/48;H01L23/485;H01L29/417;H01L29/872;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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