发明名称 |
Heat radiating apparatus of electronic component |
摘要 |
A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.
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申请公布号 |
US2005185384(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20050044629 |
申请日期 |
2005.01.27 |
申请人 |
TANAKA HIRONORI;SATO YOSHIYUKI;TAKANO WATARU;ZENITANI HIDEKI;HAYASHI MITUAKI;NISHIDA KAZUYA;IKEDA KATSUHIKO |
发明人 |
TANAKA HIRONORI;SATO YOSHIYUKI;TAKANO WATARU;ZENITANI HIDEKI;HAYASHI MITUAKI;NISHIDA KAZUYA;IKEDA KATSUHIKO |
分类号 |
H01L23/40;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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