| 摘要 |
A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.
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