| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board and a laminated plate for a printed wiring board which do not contain halogen-containing flame-retardants, exhibit relatively excellent heat resistance and each a low dissipation factor, do not cause deterioration in small-diameter drilling properties, and are both suppressed in increase of a dielectric constant. SOLUTION: The prepreg is obtained by impregnating a fiber woven fabric of a glass fiber with a thermosetting resin composition comprising (a) a compound bearing a dihydrobenzoxazine ring in the molecule, (b) a polycondensate of a phenolic compound, a triazine ring-bearing compound and an aldehyde, (c) an epoxy resin, (d) a condensed phosphate and (e) an inorganic filler, and drying the impregnated product, where the glass fiber is constituted of 50-60% of SiO<SB>2</SB>, 10-20% of Al<SB>2</SB>O<SB>3</SB>, 20-30% of B<SB>2</SB>O<SB>3</SB>, 0-5% of CaO, 0-4% of MgO, 0-0.5% of (Li<SB>2</SB>O+Na<SB>2</SB>O+K<SB>2</SB>O), and 0.5-5% of TiO<SB>2</SB>, each in wt%. COPYRIGHT: (C)2005,JPO&NCIPI |
