| 摘要 |
PROBLEM TO BE SOLVED: To dispose an electronic component terminal on an electrode fixing pad with high accuracy, while ensuring full junction strength, even when the electrode fixing pad and the electronic component terminal are jointed at high density through reflow soldering. SOLUTION: A printed circuit board comprises electrode mounting pads 111a to 111f formed on a printed wiring board 1 for mounting an electronic component terminal 33af, undergoing reflow soldering, and protruded parts 113a to 113f protruding from the electrode mounting pads 111a to 111f and applied with solder cream, together with the electrode mounting pads 111a to 111f, before the reflow soldering. The protruded parts 113a to 113f are formed narrower in width than the electrode mounting pads 111a to 111f and the electronic component terminals 33a to 33f, and the electrode mounting pads 111a to 111f are formed into substantially the same width as those of the electronic component terminals 33a to 33f. COPYRIGHT: (C)2005,JPO&NCIPI
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