| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus by which the influence of a treatment unit for carrying out prescribed treatment is reliably removed from a substrate which does not require the prescribed treatment. SOLUTION: As the carrying paths of the substrate, the substrate treatment apparatus 1 is provided with a main carrying path MTR via an etching unit 50 and a peeling unit 51, a sub carrying path STR1 (conveyer 30) by-passing the etching unit 50, and a sub carrying path STR2 (buffer 41) by-passing the peeling unit 51. In addition, the substrate treatment apparatus 1 is provided with a carrying robot 20 or 22 for receiving and delivering the substrate between the main carrying path MTR and the sub carrying paths STR1 and STR2. For example, the substrate which is not to be etched is by-passed to carry the etching unit 50 by selecting the sub carrying path STR1 by a control unit 80 and carrying the substrate to the conveyer 30 by the carrying robot 20. COPYRIGHT: (C)2005,JPO&NCIPI
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