| 摘要 |
PROBLEM TO BE SOLVED: To realize superior solder plating deposit nature and eliminate the occurrence of poor performance and poor appearance by eliminating glass component which came up on the surface of an outer conductor without applying damage to the outer conductor and a component element assembly. SOLUTION: Conductive paste containing glass component is spread on the surface of the ceramic element assembly 1, baking finish is performed, and the outer conductors 3a, 3b are formed. After that, immersion of the ceramic element assembly on which the outer conductors were formed is performed for a predetermined time in solution which contains complexing agent whose hydrogen ion exponent pH is at least 7.0. After an appropriate time, electrolysis Ni solder plating is performed, and Ni coats 4a, 4b are formed on surfaces of the outer conductors. COPYRIGHT: (C)2005,JPO&NCIPI
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