| 摘要 |
A dissipation structure of a backlight inverter is designed inside an outer housing for a notebook PC. In this dissipation structure, an inverter coil set is in contact with a dissipation plate to dissipate the heat generated by the inverter coil. In order to enhance the efficiency of dissipation, a sheet of thermally conductive material is added between the inverter coil set and the dissipation plate. The dissipation plate is a good thermal conductor, which can be replaced by an EMI shield or a metal alloy outer housing.
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