发明名称 |
Multi-layer printed circuit board and method for manufacturing the same |
摘要 |
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
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申请公布号 |
US2005186406(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20050116320 |
申请日期 |
2005.04.28 |
申请人 |
DENSO CORPORATION |
发明人 |
HARADA TOSHIKAZU;KONDO KOJI |
分类号 |
H05K1/11;H05K1/02;H05K3/38;H05K3/46;(IPC1-7):B32B3/00;H05K1/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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