PROCESSOR COMPONENT FOR CONTACTLESS SIGNAL TRANSMISSION

摘要

The invention relates to a chip arrangement comprising a first chip (10) having at least one first signal interface (18) with first coupling elements (20-30) disposed along a first line (11) in a first number density, and at least one second chip (12) having at least one second signal interface (32) with second coupling elements (34-36) disposed along a second line (13) in a second number density. The first and second coupling elements are adapted to allow contactless signal transmission between the first and second signal interface. The first and the second chip are arranged relative to each other in such a way that coupling elements of the first and the second signal interface are enabled to cooperate to transmit signals in a contactless manner. The longitudinal extension (11) of at least one of the signal interfaces along the line associated therewith is longer than the length of the overlap of the two longitudinal extensions (12). One of the signal interfaces has a higher number density of coupling elements than the other one.