PRESSURE-SENSITIVE ADHESIVE SHEET FOR FIXING SEMICONDUCTOR BASE

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet that can prevent chips from becoming scattered, even when a semiconductor base molded using silica fillers are diced into chip shapes. SOLUTION: A pressure-sensitive adhesive sheet for fixing a semiconductor base is made of a sheet base material and adhesive sheets laminated on one side of the base material. The adhesive layer is provided with a base polymer and a tackifier resin. The trackifier resin has a hydroxyl and its hydroxyl value (value obtained from the corresponding tackifier resin by the JIS K 0070-1992 7.1 neutralization titration method) is within a range of 50 to 150 KOHmg/g. COPYRIGHT: (C)2005,JPO&NCIPI