| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder-bonding structure where the occurrence of solder balls is surely prevented, at soldering. <P>SOLUTION: An electronic component 1, provided with respective electrodes 1b corresponding to solder lands 2c, is mounted on a pair of solder lands 2c formed on a printed board 2 via a cream solder 3, and the cream solder 3 is made to, after this to bond the electrode 1b of the electronic component 1 and the solder land 2c of the printed board 2. In the solder bonding structure obtained like this, each solder land 2c is provided with an extension land 2c2, extended inwardly from the bonded location of the electrode 1b with the electronic component 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
