| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate manufacturing method capable of securely judging the packaging failure of electronic components mounted on a substrate, and obtaining the reliability in soldering a substrate electrode and a component electrode. SOLUTION: A substrate member 12 supplied with an ultraviolet photopolymer 4 is rotated at a high speed by a spinner 8 or the like, and thereby uniform coating is performed on the substrate member 12. There is mounted a mask 10 equipped with an opening allowing only a part 3 of a conductive pole in a substrate electrode 2 to be irradiated with ultraviolet rays 19, so as to provide irradiation with the ultraviolet rays 19. By melting only the irradiated part, an isolated part 5 that is formed of the ultraviolet photopolymer 4 held between the conductive poles 3 in the substrate electrode 2 can be formed with good accuracy. COPYRIGHT: (C)2005,JPO&NCIPI
|
