| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacture technology of a semiconductor device, with which the inexpensive easily sealed semiconductor device can be obtained. SOLUTION: A first substrate where a plurality of semiconductor elements are installed, and a second substrate where a plurality of recessed parts are formed in positions, corresponding to a plurality of the semiconductor elements on the first substrate are bonded, by making the first substrate and the second substrate face each other so that the recessed parts on the second substrate individually cover the semiconductor elements on the first substrate. Thus, problem is solved whereby by the manufacturing method of the semiconductor device, which includes a bonding process of forming a junction for the first substrate and the second substrate, and by a dividing process of obtaining the semiconductor device which is made into pieces by dividing the junction. COPYRIGHT: (C)2005,JPO&NCIPI
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