| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of aligning a wafer with a probe card, to realize preferable heating temperatures for the temperature conditions at times about the wafer, a stage, the probe card, etc., a probe inspecting method and a probe inspection device. SOLUTION: A wafer W on a chuck stage 10 is heated, up to a specified temperature using a prober 100, comprising the chuck stage 10, the probe card 40, and a heater 20 for heating the wafer W for inspecting the wafer W at a high temperatures, after mounting. The method of aligning a wafer W with a probe card 40 comprises a step of measuring the temperatures of specified portions of the prober 100 in temperature varying regions subjected to influence of heating by the heater 20, while heating the wafer W mounted on the stage 10 by the heater 20; and aligning the wafer W with the probe card 40, after verifying that the temperatures of the measured portions have become stable. COPYRIGHT: (C)2005,JPO&NCIPI
|
