发明名称 THIN FILM MAGNETIC HEAD, WAFER FOR THIN FILM MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, HEAD ARM ASSEMBLY, HEAD STACK ASSEMBLY, AND HARD DISC DEVICE
摘要 PROBLEM TO BE SOLVED: To lessen an ATE problem by suppressing a leakage magnetic field while securing a sufficient recording magnetic field. SOLUTION: A thin film magnetic head has an upper magnetic pole tip part 10a and a lower magnetic pole tip part 8a facing mutually in a medium facing surface facing a recording medium, a recording gap layer 9 arranged between the upper magnetic pole tip part 10a and the lower magnetic pole tip part 8a, an upper magnetic pole layer 10b magnetically connected to the upper magnetic pole tip part 10a, the lower magnetic pole layer 8b magnetically connected to the lower magnetic pole tip part 8a, a connection part 18 for connecting magnetically the upper magnetic pole layer 10b and the lower magnetic pole layer 8b arranged separately from the facing surface for the medium and a thin film coil 12. At least, regarding either the upper magnetic pole layer 10b or the lower magnetic pole layer 8b, a cross section in a field parallel with a medium facing surface ABS once contracts toward the medium facing surface ABS, and the cross section is expanded at a tip part 80 contacting the medium facing surface ABS. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228444(A) 申请公布日期 2005.08.25
申请号 JP20040038050 申请日期 2004.02.16
申请人 TDK CORP 发明人 HIRABAYASHI HIROSHI;NOGUCHI KIYOSHI;OIKE TARO;NARUSHIMA SHIN;SAKAMOTO TAKAMITSU
分类号 G11B5/31;G11B5/60;(IPC1-7):G11B5/31 主分类号 G11B5/31
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