发明名称 |
POLYURETHANE POLISHING PAD |
摘要 |
<p>The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a cast polyurethane polymeric material formed with an isocyanate-terminated reaction product formed from a prepolymer reaction of a prepolymer polyol and a polyfunctional isocyanate. The isocyanate-terminated reaction product has 4.5 to 8.7 weight percent unreacted NCO; and the isocyanate-terminated reaction product is cured with a curative agent selected from the group comprising curative polyamines, curative polyols, curative alcoholamines and mixtures thereof. The polishing pad contains at least 0.1 volume percent filler or porosity.</p> |
申请公布号 |
WO2005077999(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
WO2005US01192 |
申请日期 |
2005.01.13 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
KULP, MARY JO |
分类号 |
B24B37/04;C08G18/10;C08G18/48;(IPC1-7):C08G18/10 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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