发明名称 LIQUID FILM FORMING METHOD AND METHOD OF FORMING SOLID FILM
摘要 <P>PROBLEM TO BE SOLVED: To suppress a discharge of liquid out of a substrate to be treated, and to uniformly form a liquid film in a technology which spirally feeds the liquid on the substrate to be treated to perform a film formation. <P>SOLUTION: A dripper is radially moved so that there may be changed a moving pitch of the dripper in a radial direction which is produced whenever the substrate to be treated makes a round while the liquid drips on the substrate to be treated from the dripper and at the same time the substrate to be treated is rotated. The rotational frequency of the substrate and the feed speed v of the liquid from the dripper are adjusted so that the dripped liquid film may not be moved by a centrifugal force applied on the dripped liquid film by accompanying a radial movement of the substrate to be treated of the dripper, and the liquid film is formed. Thereafter, the substrate to be treated is rotated by using a rotational frequency that is less than a maximum rotational frequency, by which the liquid film at a maximum periphery on the substrate to be treated does not move out of the substrate to be treated by the centrifugal force. The substrate to be treated is rotated by making the upper part of the substrate on which the liquid film is formed as almost closed space. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005229115(A) 申请公布日期 2005.08.25
申请号 JP20050030832 申请日期 2005.02.07
申请人 TOSHIBA CORP 发明人 ITO SHINICHI
分类号 G03F7/16;B05C11/00;B05C11/08;B05D1/40;H01L21/027 主分类号 G03F7/16
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