| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad having grooved patterns for reducing wake mixed with slurry in a groove. <P>SOLUTION: The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries (168, 172), (312, 316), (412, 416), (508, 512) having shapes and locations that are a function of the size of a polished surface (116) of the article being polished and the type of polisher (100) used. The polishing region has several zones (Z1-Z3), (Z1'-Z3'), (Z1"-Z3"), (Z1"'-Z3"') each containing corresponding grooves (148, 152, 156), (304, 308, 324), (404, 408, 424), (520, 524, 528) having orientations selected depending on the directions of one or more velocity vectors (V1-V4), (V1'-V4'), (V1"-V4"), (V1"'-V4"') of the wafer in that zone. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
