发明名称 DIE THICKNESS MEASURING METHOD, AND DIE THICKNESS MEASURING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide a die thickness measuring method and a die thickness measuring instrument of a low cost capable of measuring accurately a thickness in a side face of a molding die used for casting molding of a plastic lens, and capable of saving a space. SOLUTION: The side faces of the molding dies 301, 302 are irradiated with a laser spot beam to be transmitted through the side faces of the molding dies 301, 302, while moving an irradiation position along a thickness direction of the molding dies 301, 302, reflected beams from the side faces of the molding dies 301, 302 are received, and the thicknesses in the side faces of the molding dies 301, 302 and/or a clearance distance between the side faces of the molding dies 301, 302 are(is) measured based on a change in received luminous energy and a moving amount of the irradiation position. A light shielding plate 140 is arranged in the vicinity of the side faces of the molding dies 301, 302. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005227159(A) 申请公布日期 2005.08.25
申请号 JP20040036751 申请日期 2004.02.13
申请人 SEIKO EPSON CORP 发明人 SHIMIZU HIROSHI
分类号 G01B11/06;B29C39/26;B29L11/00;(IPC1-7):G01B11/06 主分类号 G01B11/06
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