| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of withstanding the junction destruction of the solder joined joint part of a mounting pad on a printed wiring board and the soldering ball electrode of a package component due to a difference between linear expansion of a printed wiring board material and linear expansion of a package component material. SOLUTION: The printed wiring board comprises an insulating substrate 1; a mounting pad group provided on the outer layer of the insulating substrate 1 and disposed two dimensionally; and a mounting pad group assumed to be an almost spherical mounting pad 3 provided extending on the mounting pad group, and including a plurality of non-penetration through holes 5 disposed on an outer edge. An electrode group of a package component 2 mounted on the outer layer and the mounting pad group of the insulating substrate 1 are joined through soldering because a solder flows also into the non-penetration through hole 5. COPYRIGHT: (C)2005,JPO&NCIPI
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