| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation member excellent in shape followability and different from paste, and also to provide its manufacturing method and an electronic apparatus incorporating it. SOLUTION: In the heat dissipation member, a silicone layer having E type hardness by JIS K 6253 is≤65. The layer E and an adhesive thermoplastic resin layer are stacked one on the other putting a metal foil therebetween, and its heat conductivity is≥2.0 W/mK. After two layers of the metal foil and the silicone layer are manufactured, the adhesive thermoplastic resin layer is formed on an aluminum foil surface on the opposite side where no silicone layer is existent. The electronic apparatus is characterized in that a silicone layer side is adapted to face a heat developable electronic component and an adhesive thermoplastic resin layer side adapted to face a heatsink to incorporate the heat dissipation member. COPYRIGHT: (C)2005,JPO&NCIPI
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