Semiconductor package for lowering electromagnetic interference and method for fabricating the same

摘要

A semiconductor package for lowering electromagnetic interference and a method for fabricating the same are proposed. The semiconductor package includes a chip carrier, at least one chip attached and electrically connected to the chip carrier, and an encapsulation body formed on the chip carrier for encapsulating the chip. The encapsulation body includes an electromagnetic absorbing layer made of an organic material filled with a plurality of porous metal particles. The electromagnetic absorbing layer absorbs electromagnetic waves generated by the chip and converts the electromagnetic waves to heat so as to improve the heat dissipation efficiency and reduce electromagnetic interference for the semiconductor package.