发明名称 |
Method for packaging semiconductor chips and corresponding semiconductor chip system |
摘要 |
A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip. |
申请公布号 |
US2005186703(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20050041157 |
申请日期 |
2005.01.21 |
申请人 |
WEIBLEN KURT;BENZEL HUBERT;PINTER STEFAN;GUENSCHEL ROLAND;HAAG FRIEDER |
发明人 |
WEIBLEN KURT;BENZEL HUBERT;PINTER STEFAN;GUENSCHEL ROLAND;HAAG FRIEDER |
分类号 |
H01L23/02;B81B3/00;B81B7/00;B81C1/00;B81C3/00;G01L9/00;G01P1/02;H01L21/50;H01L21/52;H01L21/56;H01L21/60;(IPC1-7):H01L21/50 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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