发明名称 Conductive paste and ceramic electronic component
摘要 A conductive paste contains conductive powder, glass powder and an organic vehicle. The glass powder contains about 10% to 31% of B<SUB>2</SUB>O<SUB>3</SUB>, about 65% to 86% of SiO<SUB>2</SUB>, and more than about 0.5% to less than about 5% of M<SUB>2</SUB>O on a weight basis, wherein M represents an alkali metal element. A ceramic electronic component includes a ceramic element and an external conductor placed on the component element. The external conductor contains a glass component containing about 10% to 31% of B<SUB>2</SUB>O<SUB>3</SUB>, about 65% to 86% of SiO<SUB>2</SUB>, and more than about 0.5% to less than about 5% of M<SUB>2</SUB>O on a weight basis, wherein M represents an alkali metal element.
申请公布号 US2005184278(A1) 申请公布日期 2005.08.25
申请号 US20050041416 申请日期 2005.01.25
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MIKI TAKESHI
分类号 H01B1/02;H01B1/16;H01G4/232;H01G4/30;H01G4/33;H05K1/09;(IPC1-7):H01B1/02 主分类号 H01B1/02
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