SEMICONDUCTOR DEVICE HAVING MULTI LOW PAD STRUCTURE, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a multi pad low structure, and to provide a manufacturing method of the same. SOLUTION: The semiconductor device is provided with a printed circuit board, and a first low, a second low and a third low including a power and/or a signal pad, and a plurality of input and output buffers mounted on the printed circuit board. A part of a plurality of the input and output buffers is provided between the first low and the second low, and another part of a plurality of the input and output buffers is provided between the second low and the third low. The manufacturing method of the semiconductor device is also provided. COPYRIGHT: (C)2005,JPO&NCIPI