发明名称 LASER IRRADIATING APPARATUS AND LASER IRRADIATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser irradiating apparatus which can prevent the generation of interference fringes caused by variations in the thickness of a processed film, and to provide a laser irradiation method. SOLUTION: A laser annealing apparatus 10 comprises a laser oscillator 12; a process stage device 30 for supporting a substrate W, performing smooth translating movement of the substrate W in an X-Y plane, and conducting vertical movements thereof, in Z axis direction; and a stage angle adjusting device 60 for adjusting the angle of the process stage device 30. A main controller 100 reads out a measured film thickness value of the processed film from a memory 110, calculates the tilt angle of a stage 31 so that the thickness in the incident direction of a laser beam, corresponding to the irradiation position of the laser beam, is a preset value, and controllably drives the stage angle adjusting device 60, having a tilt angle so as to cause no optical interference of the film thickness in the laser beam irradiating direction. Consequently, even if there is dispersion in the thickness t of a processed film T, the apparatus can prevent generation of interference fringes caused by annealing operation and can increase a production efficiency of annealing operation. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228962(A) 申请公布日期 2005.08.25
申请号 JP20040036920 申请日期 2004.02.13
申请人 SUMITOMO HEAVY IND LTD 发明人 SUZUKI TAKEOMI
分类号 B23K26/00;B23K26/10;H01L21/20;H01L21/268;(IPC1-7):H01L21/268 主分类号 B23K26/00
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