发明名称 CURING COMPOSITION FOR SOLID-STATE IMAGING DEVICE, AND THE SOLID-STATE IMAGING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a curing composition for a solid-state imaging device which obtains a curing film at a high refractive index and superior light resistance, and to provide the curing film for the solid-state imaging device having superior antireflection properties. SOLUTION: The curing composition contains (1) titanium oxide particles of 100 parts by weight coated with oxide of one or more metal elements, selected from among a group consisting of silicon, aluminium, titanium, zirconium, tin, antimony and zinc; (2) a curing compound of 1 to 150 parts by weight; and (3) a curing catalyst of 0.1 to 100 parts by weight. The solid-state imaging device 10 has a laminate, containing the curing film formed by curing this curing composition under a microlens, and can effectively be used for a use field of an optical system mechanism of a camera and the like, by using various microlens arrays. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228888(A) 申请公布日期 2005.08.25
申请号 JP20040035524 申请日期 2004.02.12
申请人 JSR CORP 发明人 YASHIRO TAKAO;HONDA YOSHIKAZU;SHIMOMURA HIROMI;YAMAMURA TETSUYA;TANABE TAKAYOSHI
分类号 H01L27/14;(IPC1-7):H01L27/14 主分类号 H01L27/14
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