发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, wherein a crystal semiconductor film formed on a semiconductor substrate is superior in crystallinity and the surface of the crystal semiconductor film has superior planarity. SOLUTION: The method for manufacturing a semiconductor device, wherein a crystal semiconductor film is formed on a semiconductor substrate, includes a non-crystal semiconductor film formation step (S101) of forming a non-crystalline semiconductor film on the semiconductor substrate, a first laser light irradiation step (S102) of melting the non-crystal semiconductor film by its thickness, by having a first laser light irradiated to the non-crystalline semiconductor film, a crystallization step (S103) of crystalizing the non-crystalline semiconductor film and transform it to a crystal semiconductor film, a cap film forming step (S104) of forming a cap film on the crystal semiconductor film, and a second laser light irradiation step (S105) of having a second laser light that does not have the amount of energy sufficient to melt the crystal semiconductor film by its thickness, irradiated to the crystal semiconductor film via the cap film. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228808(A) 申请公布日期 2005.08.25
申请号 JP20040033724 申请日期 2004.02.10
申请人 SHARP CORP 发明人 OKAZAKI SHINYA;NAKAYAMA JUNICHIRO
分类号 H01L21/20;H01L21/268;(IPC1-7):H01L21/20 主分类号 H01L21/20
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