| 摘要 |
PROBLEM TO BE SOLVED: To prevent a scuff mark or the remain of a bending mark on a wiring board when a gate, a runner, and a cull sections are removed, after a semiconductor chip mounted on a film-like wiring board is sealed by a transfer mold. SOLUTION: Before the semiconductor chip is sealed, an opening 2C, penetrated at the rear face from a plane on which the semiconductor chip is mounted, is formed on the region overlapped with the runner of an insulating board 2. After sealing with resin, a load is applied to a mold 7A from the component side of the insulating board, a load is applied to the runner 7C filled in the opening 2C from the rear surface of the insulating board, an angle formed between the region overlapped with the mold 7A of the insulating board and the region overlapped with the gate 7B; and the runner 7C is set to a predetermined angle, and the gate 7B and the runner 7C are released from the insulating board 2. COPYRIGHT: (C)2005,JPO&NCIPI
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