发明名称 |
Lift-off method and chemical liquid tank |
摘要 |
A lift-off procedure is provided which enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure. A wafer having a surface on which a pattern is formed which contains a pattern portion to be removed is soaked into a chemical liquid at an angle at which the surface faces downward.
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申请公布号 |
US2005183753(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20050111860 |
申请日期 |
2005.04.22 |
申请人 |
SUZUKI MASARU;NITTA YOSHIKI;OHMURO KAZUHIKO |
发明人 |
SUZUKI MASARU;NITTA YOSHIKI;OHMURO KAZUHIKO |
分类号 |
H01L21/28;B08B3/02;B08B3/04;H01L21/00;H01L21/306;(IPC1-7):B08B3/00 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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