发明名称 |
Thermal transfer element |
摘要 |
A thermal transfer element is capable of improving transfer characteristics because transfer is performed at a low temperature. The thermal transfer element includes: a base substrate as a support substrate; a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy; a transfer layer formed on the light-to-heat conversion layer to form an image; and a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate. The release layer includes a silicon polymer having a glass transition temperature (Tg) of 25° C. or less, and low surface energy. In a further embodiment, the thermal transfer element includes an interlayer formed between the light-to-heat conversion layer and the transfer layer to protect the light-to-heat conversion layer.
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申请公布号 |
US2005186366(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040014211 |
申请日期 |
2004.12.17 |
申请人 |
KIM MU-HYUN;CHIN BYUNG-DOO;SUH MIN-CHUL;YANG NAM-CHOUL;LEE SEONG-TAEK |
发明人 |
KIM MU-HYUN;CHIN BYUNG-DOO;SUH MIN-CHUL;YANG NAM-CHOUL;LEE SEONG-TAEK |
分类号 |
H05B33/10;B32B27/00;B41M5/40;B41M5/42;B41M5/44;G12B15/06;H01L51/00;H01L51/40;H01L51/50;H05B33/02;H05B33/12;H05B33/14;H05K7/20;(IPC1-7):B41M5/40 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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