发明名称 Thermal transfer element
摘要 A thermal transfer element is capable of improving transfer characteristics because transfer is performed at a low temperature. The thermal transfer element includes: a base substrate as a support substrate; a light-to-heat conversion layer formed on the base substrate to convert incident light to thermal energy; a transfer layer formed on the light-to-heat conversion layer to form an image; and a release layer formed between the base substrate and the light-to-heat conversion layer to facilitate delamination of the light-to-heat conversion layer from the base substrate. The release layer includes a silicon polymer having a glass transition temperature (Tg) of 25° C. or less, and low surface energy. In a further embodiment, the thermal transfer element includes an interlayer formed between the light-to-heat conversion layer and the transfer layer to protect the light-to-heat conversion layer.
申请公布号 US2005186366(A1) 申请公布日期 2005.08.25
申请号 US20040014211 申请日期 2004.12.17
申请人 KIM MU-HYUN;CHIN BYUNG-DOO;SUH MIN-CHUL;YANG NAM-CHOUL;LEE SEONG-TAEK 发明人 KIM MU-HYUN;CHIN BYUNG-DOO;SUH MIN-CHUL;YANG NAM-CHOUL;LEE SEONG-TAEK
分类号 H05B33/10;B32B27/00;B41M5/40;B41M5/42;B41M5/44;G12B15/06;H01L51/00;H01L51/40;H01L51/50;H05B33/02;H05B33/12;H05B33/14;H05K7/20;(IPC1-7):B41M5/40 主分类号 H05B33/10
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