| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize miniaturization, regarding a semiconductor device referred to as SIP (System In Package). <P>SOLUTION: The semiconductor device is provided with a package substrate 5; a microcomputer chip 1 which is arranged on the core layer 5c of the package substrate 5 and equipped with calculation processing functions; a flash memory 2 and a DRAM 3 which were equipped with memory circuits, respectively, wires 6 which connect the flash memory 2 and the DRAM 3 to the package substrate 5, respectively, sealing body 7 which seals the flash memory 2 and the DRAM 3 on the package substrate 5; and a plurality of solder balls 8 which are connected to bump lands at a rear surface 5b side of the package substrate 5. The package substrate 5 is provided with a main surface side wiring layer 5d which is arranged at a main surface 5a side from the core layer 5c, and a rear surface side wiring layer 5e which is arranged at the rear surface 5b side from the core layer 5c. Wires 5j, 5k of the package substrate 5 are distributed on the upper side and the lower side of the microcomputer chip 1, the number of wiring layers of the package substrate 5 is reduced, to attain miniaturization of an SIP 4 (semiconductor device). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
