Surface mount optoelectronic component, has thicker electrically conductive base material providing external connections with circuit board, where bottom and side surface of base material couples respective illuminators

摘要

The component has a thicker electrically conductive base material (1) for providing external connections with a printed circuit board. An opaque plastic material (2) houses for the component. A cavity (5) within the plastic material mounts an optoelectronic chip that is connected to the base material by a metallic wire (4). Bottom and side surface of the base material couples top and side illuminators.