Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen

摘要

An electronic-parts mounting apparatus includes an electronic-parts feeder. A mounting head operates for carrying electronic parts from the electronic-parts feeder. The mounting head includes a plurality of nozzles for holding the electronic parts respectively. An electronic-parts mounting portion operates for enabling the mounting head to mount the electronic parts on a circuit board. A first mechanism operates for rotating each of the nozzles. A second mechanism operates for moving each of the nozzles upward and downward. The first mechanism may include a pinion provided on an outer circumferential surface of each of the nozzles, and a rack meshing with the pinion.