发明名称 PATTERN FORMING PROCESS
摘要 <p>The object of the present invention is to provide pattern forming processes that may form permanent patterns such as a wiring pattern with high fineness and preciseness, and sufficient efficiency due to suppressing the image deformation formed on pattern forming materials. In order to attain the object, a pattern forming process is provided that comprises modulating a laser beam irradiated from a laser source, compensating the modulated laser beam, and exposing a photosensitive layer by the modulated and compensated laser beam, wherein the photosensitive layer is disposed on a support to form a pattern forming material, the modulating is performed by a laser modulator that comprises plural imaging portions each capable of receiving the laser beam and outputting the modulated laser beam, and the compensating is performed by transmitting the modulated laser beam through plural microlenses each having a non-spherical surface capable of compensating the aberration due to distortion of the output surface of the imaging portion, and the plural microlenses are arranged to a microlens array.</p>
申请公布号 WO2005078776(A1) 申请公布日期 2005.08.25
申请号 WO2005JP02112 申请日期 2005.02.07
申请人 FUJI PHOTO FILM CO., LTD.;WAKATA, YUICHI;TAKASHIMA, MASANOBU;ISHIKAWA, HIROMI;SHIMOYAMA, YUJI 发明人 WAKATA, YUICHI;TAKASHIMA, MASANOBU;ISHIKAWA, HIROMI;SHIMOYAMA, YUJI
分类号 G03F7/004;G03F7/027;G03F7/031;G03F7/20;(IPC1-7):H01L21/027 主分类号 G03F7/004
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