| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid-cooling system having a heat dissipating member and/or a tank which realize small thickness, low cost, and high reliability in an electronic apparatus furnished with the liquid-cooling system; and to provide the electronic apparatus. <P>SOLUTION: The liquid-cooling system is constituted by mutually connecting a heat-receiving jacket for receiving heat, a heat-dissipating member for dissipating the heat received by the heat-receiving jacket, and a tank for storing liquid-cooling medium by conduits and filling a liquid-cooling medium in the heat-receiving jacket, the heat-dissipating member, and the tank including the conduits to form a circulating flow of the filled liquid-cooling medium by a liquid transfer means. The tank 14 is formed between a surface of a board of good thermal conduction and good heat resistance and a flexible film or a sheet of good thermal conduction and good heat resistance, and the heat-dissipating member composed of a heat-dissipating conduit 9 is formed between the other surface of the board and a flexible film or a sheet of good thermal conduction and good heat resistance. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
